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Bob is the president of NHanced Semiconductors, Inc. He has spearheaded the development and delivery of cutting-edge 3D and 2.5D integration technology for high energy physics, medicine, automotive, military, HPC, and other fields. He has managed hardware engineering teams in several organizations, including successful startups. Bob received the 2009 SEMI Award for North America for his pioneering work in 3D IC integration and the 2015 3DIncites Individual Achievement Award.
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